Multifunctional Materials Enable Single-Layer Temporary Bonding And Debonding
EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution for Fan-out Wafer-Level Packaging
US20160133486A1 - Double Layer Release Temporary Bond and Debond Processes and Systems - Google Patents
Laser releasable temporary bonding and debonding processes | Download Scientific Diagram
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package - ScienceDirect
Figure 1 from Advanced wafer bonding and laser debonding | Semantic Scholar
KINGYOUP Laser Debonding System - Kingyoup Enterprises Co., Ltd.
Evaluation of the effect of diode laser for debonding ceramic brackets on nanomechanical properties of enamel Sinaee N, Salahi S, Sheikhi M - Dent Res J
IFTLE 235 KNS Update on Thermo compression Bonding and Dow Update on Mechanical & Laser Debondable Temp Adhesives | Insights From Leading Edge
仮接合・剥離
PRODUCTS Laser Debonding Lab kit | Optopia
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics | Semantic Scholar
Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test | Semantic Scholar
Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices | Semantic Scholar
Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions - AI Technology, Inc.
Laser-Assisted Ceramic Debonding | Fotona
Asteroid - Successful Laser Debonding
445-nm diode laser-assisted debonding of self-ligating ceramic brackets
PRODUCTS Laser Debonding Lab kit | Optopia
BrewerBOND® T1100/C1300 Series Materials - Brewer Science
